Classification and Selection of PCB High-Frequency Board Materials
Release time:
2025-02-20
The PCB high-frequency board refers to a special circuit board with a higher electromagnetic frequency, used for high frequencies (frequency greater than 300MHZ or wavelength less than 1 meter)...
PCB high-frequency boards refer to special circuit boards with higher electromagnetic frequencies, used in the fields of high frequency (frequency greater than 300MHZ or wavelength less than 1 meter) and microwave (frequency greater than 3GHZ or wavelength less than 0.1 meter) PCBs. They are produced using ordinary rigid circuit board manufacturing methods for certain processes on microwave substrate copper-clad laminates or through special treatment methods. Generally speaking, PCB high-frequency boards can be defined as circuit boards with frequencies above 1GHz. The substrate material needs to have excellent electrical performance, good chemical stability, and very low loss requirements on the substrate as the power signal frequency increases, highlighting the importance of PCB high-frequency materials.
What are the classifications of PCB high-frequency board materials?
1. Thermosetting materials filled with ceramic powder
Processing methods
The processing flow is similar to that of epoxy resin/glass woven fabric (FR4), but the board is relatively brittle and prone to breakage. The lifespan of drill bits and milling cutters should be reduced by 20% during drilling and milling.
2. PTFE (Polytetrafluoroethylene) materials
Processing methods
1. Cutting: The protective film must be retained during cutting to prevent scratches and dents.
2. Drilling:
(1) Use a brand new drill bit (standard 130), stacking one piece at a time is best, with a foot pressure of 40psi;
(2) An aluminum sheet is used as a cover plate, then use a 1mm melamine backing board to tighten the PTFE board;
(3) After drilling, use an air gun to blow out the dust inside the holes;
(4) Use the most stable drilling machine, drilling parameters (basically, the smaller the hole, the faster the drilling speed, the smaller the chip load, and the smaller the return speed).
3. Hole treatment
Plasma treatment or sodium naphthalene activation treatment is beneficial for hole metallization.
4. PTH copper deposition
(1) After micro-etching (with a micro-etching rate controlled at 20 microinches), the board enters from the oil removal tank for PTH;
(2) If necessary, pass through the second PTH, just need to enter the board from the expected tank.
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Shantou Huaxin Electronic Technology Co., Ltd
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