Development Trends and Strategies of PCB Design


Release time:

2022-06-13

The electronic industry, driven by Moore's Law, has products with increasingly powerful functions.

The electronic industry, driven by Moore's Law, has products with increasingly powerful functions, higher integration levels, faster signal rates, and shorter R&D cycles. As electronic products continue to miniaturize, become more precise, and operate at higher speeds, PCB design must not only complete the circuit connections of various components but also consider the various challenges brought by high speed and high density. PCB design will present the following trends:


1. The R&D cycle is continuously shortening. PCB engineers need to use top-notch EDA tool software; pursue success in one board, comprehensively consider various factors, and strive for success at once; parallel design by multiple people, with division of labor and cooperation; module reuse, emphasizing technological accumulation.
2. Signal rates are continuously increasing. PCB engineers need to master certain high-speed PCB design skills.
3. High density of single boards. PCB engineers must keep up with industry frontiers, understand new materials and new processes, and use top-notch EDA software that can support high-density PCB design.
4. The operating voltage of gate circuits is getting lower. Engineers need to clarify the power supply path, not only to meet the current-carrying capacity requirements but also to use appropriate decoupling capacitors, and if necessary, adopt a method of adjacent power and ground planes with tight coupling to reduce the impedance of the power ground plane and minimize power ground noise.
5. SI, PI, and EMI issues are becoming more complex. Engineers need to possess basic skills in SI, PI, and EMI design for high-speed PCBs.
6. The use of new processes and new materials, such as buried resistors and buried capacitors, will be promoted.


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